Physical vapour deposition (PVD) is used to describe any of a variety of methods to deposit thin films by the condensation of a vaporized form of material onto various surfaces. The metallic elements of the layers consisting of titanium, chrome and aluminum, make a connection to nitrogen and carbon under the impact of a plasma and temperatures of 200 °C to 500 °C. They provide a strong ceramic in this way. The hardness of generated layers are in a range of 1000 to 3800 HV, the coating thickness is between 1 to 10 µm, depending on use.
The PVD hard material coating is carried out at eifeler almost exclusively by means of arc vapor deposition (electric arc vapor deposition ) with temperatures < 450 degrees centigrade. With the arc process technology an excellent adhesion is achieved without hardness loss, distortion or change of the micro-structure of the base material.
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